OIS lower solder ball welding machine

model：JKA051

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Product features
Application scope
Specification parameters
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OIS lower solder ball...

Product features

In the ring-shaped welding head, the solder balls are separately sent to the nozzle mouth by the ball dividing plate, and then the solder balls at the nozzle mouth are melted and sprayed to the VCM pad position by the laser, and the IOS loop off wire is connected to the VCM lower pad position. In the whole process, nitrogen plays a role of auxiliary supply, preventing oxidation of tin balls and judging whether there are tin balls.

The equipment adopts a high-precision visual positioning correction system and a linear motor movement system. The rotating mechanism rotates the product to realize high-precision welding of different pin positions of the product.

Specification parameters

Laser mode	Continuous fiber laser
Laser wavelength	1060-1070nm
Laser power (optional)	5W-300W
Solder ball specification (optional)	50μm-1200μm
Spray ball speed	UPH＞12000(Ball)
Driving mode:	Linear motor drive
Shaft accuracy	±3μm
CCD positioning mark accuracy	±0.02mm
Equipment advantages	1) Do not touch the product during welding to avoid damage to the product: 2) no flux is required to keep the product clean; 3) The equipment can be compatible with a wide range of tin ball diameters and is simple to change; 4) The spraying speed is leading the industry level, and the single point spraying speed can be within 0.2S; 5) High precision control system ensures the stability of laser energy and welding quality;
Environmental requirements	18-27°C
Power supply and rated power	AC220V 50/60HZ, 3.5KW

Application scope

It is suitable for precision welding of semiconductor packaging, mechanical hard disk, camera module and voice coil motor of electronic products such as mobile phones and computers.