IC laser engraving machine

model：JKL015

Product features

The laser irradiates the IC chip inside the camera module of the mobile phone.

Scan the internal IC of the camera module of the mobile phone after laser，marking and coding with QR code, date series no for tracing

Specification parameters

Equipment capacity	UPH > 2100 Pcs/H
Laser accuracy	≤±0.05mm
Repetitive positioning accuracy of linear module	±3μm
Product outline dimension	178753mm
Code scanning recognition rate	＞99.99%
Qualified rate of radium carving	≥ 99.99%
Overall quality	1500KG
MTBF&MTBA	MTBF ≥ 168 hours; MTBA ≥ 3 hours
Air source	0.3~0.7MPa
Power supply and rated power	AC220V 50/60HZ, 10KW
Radium carving QR code level	Above grade A (95%) and above grade B (100%)

Application scope

Suitable for internal IC laser and detection of various types of mobile phone camera modules.