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Product features
The laser irradiates the IC chip inside the camera module of the mobile phone.
Scan the internal IC of the camera module of the mobile phone after laser.
Specification parameters
Equipment capacity UPH > 2100 Pcs/H
Laser accuracy ≤±0.05mm
Repetitive positioning accuracy of linear module ±3μm
Product outline dimension 178*75*3mm
Code scanning recognition rate >99.99%
Qualified rate of radium carving ≥ 99.99%
Overall quality 1500KG
MTBF&MTBA MTBF ≥ 168 hours; MTBA ≥ 3 hours
Air source 0.3~0.7MPa
Power supply and rated power AC220V 50/60HZ, 10KW
Radium carving QR code level Above grade A (95%) and above grade B (100%)
Application scope
Suitable for internal IC laser and detection of various types of mobile phone camera modules.
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